Hot glue did the trick. The B2B interconnector easily falls out.
I already fixed a couple of -10s in my lab, both of them with HW rev 2A 4B / 0222.
Is it only this HW revision that is affected?
This seems to both affect the CPU identification in Do-More designer and the I/O behavior. Sometimes the connector has sufficient contact to identify the I/O board and in other cases the CPU doesn't see the I/O board at all.
Anything in that same housing had the potential problem, so -10, -M, EBC, DMIO, etc. The I/O is also on the other board, so yes, both discovery and I/O behavior could be a bit dodgy. As long as the connector stays mated, there should be no issue.
This whole problem has been frustrating and embarrassing. We had shipped 1000s of those units previously with no problems, and then all of the sudden it was a problem. As I mentioned, we thought it was an assembly issue at first, but eventually we figured out the alternative source of the connector didn't work like the original. We used the hot glue approach for production and repair until we used up the supply, then we moved to connector with longer pin engagement.
Between C19, inflation, chip shortage, etc, this has been a humdinger of a decade so far. Starting to better understand why my grandparents (who were kids during the Great Depression) were the way they were.